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Digital
ASC can provide quick turns on digital boards as fast as 24 hours.
RF Metal-backed
Single-sided, double-sided and multilayer PCBs with metal cladding for improved thermal management and grounding.
RF/Microwave
ASC has extensive experience and technical expertise in the manufacturing of time critical, high technology RF circuits.
Flex and Rigid-Flex
ASC offers single-sided, double-sided, multilayer and rigid flex.
MCPCB/IMPCB
Boards with metal cladding or metal core for improved thermal management.
DFM 101: Plating Methods
DFM 101
DFM 101: Plating Methods
March 1, 2022 By: Anaya Vardya
Introduction
One of the biggest challenges facing PCB designers is not understanding the cost drivers in the PCB manufacturing process. This article is the latest in a series that will discuss these cost drivers (from the PCB manufacturer’s perspective) and the design decisions that will impact product ...
DFM 101: Edge Plating
DFM 101
DFM 101: Edge Plating
March 18, 2022 By: Anaya Vardya
One of the biggest challenges facing PCB designers is not understanding the cost drivers in the PCB manufacturing process. This article is the latest in a series that will discuss these cost drivers (from the PCB manufacturer’s perspective) and the design decisions that will impact product reliability.
What ...
DFM 101: Solder Mask and Legend
DFM 101
DFM 101: Solder Mask and Legend
May 2, 2022 By: Anaya Vardya
Introduction
One of the biggest challenges facing PCB designers is understanding the cost drivers in the PCB manufacturing process. This article is the latest in a series that will discuss these cost drivers from the PCB manufacturer’s perspective, and the design decisions that will impact product reliability.
DFM 101: Final Finishes—ENIG and ENIPIG
DFM 101
DFM 101: Final Finishes—ENIG and ENIPIG
August 11, 2022 By: Anaya Vardya
Introduction
One of the biggest challenges facing PCB designers is not understanding the cost drivers in the PCB manufacturing process. This article is the latest in a series that will discuss these cost drivers (from the PCB manufacturer’s perspective) and the design decisions that will impact product ...
DFM 101: Final Finishes ImmSn
DFM 101
DFM 101: Final Finishes ImmSn
December 30, 2022 By: Anaya Vardya
One of the biggest challenges facing PCB designers is understanding the many cost drivers in the PCB manufacturing process. This article is the latest in a series that will discuss these cost drivers (from the PCB manufacturer’s perspective) and the design decisions that will impact product reliability.
Final ...
DFM 101: Final Finishes—Electrolytic Nickel/Gold
DFM 101
DFM 101: Final Finishes—Electrolytic Nickel/Gold
January 31, 2023 By: Anaya Vardya
One of the biggest challenges facing PCB designers is not understanding the cost drivers in the PCB manufacturing process. This article is the latest in a series that will discuss these cost drivers (from the PCB manufacturer’s perspective) and the design decisions that will impact product ...
DFM 101: Final Finishes—HASL
DFM 101
DFM 101: Final Finishes—HASL
February 15, 2023 By: Anaya Vardya
One of the biggest challenges facing PCB designers is not understanding the cost drivers in the PCB manufacturing process. This article is the latest in a series that will discuss these cost drivers (from the PCB manufacturer's perspective) and the design decisions that will impact product reliability.
Final Finishes: OSP
DFM 101
Final Finishes: OSP
April 11, 2023 By: Anaya Vardya
Introduction
One of the biggest challenges facing PCB designers is not understanding the cost drivers in the PCB manufacturing process. The next final finishes to discuss in this series is OSP. As with all surface finishes there are pros and cons with the decision of which ...