Embedded Passives

Explore the Future of PCBs with Embedded Resistors:

 

Embedded Passives 

The term embedded passives refer to a printed circuit design and manufacturing technology in which passive components (such as resistors or capacitors) are integrated directly into the substrate, or the body, of a printed circuit board rather than being discrete components mounted on the surface. This technique is often employed in microelectronics and integrated circuits to reduce size, weight, and assembly costs while improving reliability and performance. By embedding passive components, manufacturers can create more compact and efficient electronic systems, especially in applications where space is limited or where high-frequency performance is critical.

Embedded Capacitance Materials

Embedded Capacitance Material consists of a very thin layer of ceramic-filled epoxy sandwiched between two layers of copper foil. It can be patterned as a power and ground plane pair for a lower impedance, shared capacitance power distribution network. The biggest design benefit is that it increases the usable board area by allowing for the removal of many, if not all, capacitors equal to or below 0.1 Microfarad (μF) and their associated solder joints and vias. 

Embedded Resistor Materials

Embedded resistors are planar resistive elements made into a thin film. This type of resistor becomes part of the etched and printed circuitry on the standard printed circuit board layer, and in assembly it eliminates the need for resistor solder joints. Embedded resistors are used over surface discrete resistors when there is a need to miniaturize a PCB foot-print, increase density, improve signal integrity or electrical performance, and increase reliability.

 

  • Space-saving: Integrating passive components directly into the PCB eliminates the need for separate components, saving valuable board space. This is particularly beneficial in miniaturized electronic devices where space is limited.
  • Reduced parasitic effects: Embedding passive components minimizes parasitic effects such as parasitic capacitance and inductance that can occur with discrete components. This results in improved high-frequency performance and signal integrity.
  • Improved reliability: Embedded passive components are less prone to damage from mechanical stress, vibration, and environmental factors compared to discrete components. This enhances the overall reliability and durability of the electronic system.
  • Enhanced electrical performance: Embedded passive components can provide more precise and consistent electrical characteristics compared to discrete components, leading to better matching and control of component values across different parts of the circuit.
  • Cost-effectiveness: While there may be initial setup costs associated with embedded passive technology, it can lead to cost savings over the long term due to reduced component count, simplified assembly processes, and potentially lower maintenance and warranty costs.
  • Enhanced thermal management: Embedding passive components within the PCB allows for more efficient thermal dissipation compared to discrete components, leading to better heat distribution and improved thermal management in high-power applications.
  • Design flexibility: Embedded passive technology offers greater design flexibility, allowing for customized component values, geometries, and placement to optimize circuit performance and functionality.
  • Improved manufacturability: Integrating passive components into the PCB simplifies the assembly process, reduces handling steps, and improves manufacturing yield, leading to higher production efficiency and lower manufacturing costs.
  • Consumer electronics
  • MilAero
  • Biomedical
  • Automotive
  • Microwave/RF

Your expert for Embedded Passives is Kevin Dial.

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ASC works with the following materials on FR4 and high-performance laminates, including Rogers RO3000, 4000, and RT/duroid 6000 series, and flex polyimide

 

Resistance:

  • Quantic Ticer TCR®

  • Quantic Ticer TCR-EHF®

  • Quantic OhmegaPly®

    (work with 10-1000 Ohm/square materials)

Capacitance:

  • Oak-Mitsui FaradFlex®

We are able to pair these technologies with others in our HDI portfolio such as blind/buried/micro vias, cavities, and coins.