Large computers and high-speed, high-clock-rate electronic devices generate large amounts of heat that must be efficiently dissipated for proper functioning of the device. Examples are: telecom systems, automotive, computer,power supply, military and motor control systems.
Instead of dissipating the heat via additional components such as cooling surfaces, we offer an elegant internal solution to the problem: we make the PCB itself thermally conductive. The heat from the components is dissipated via a heat-conductive bonding film onto the aluminum or copper layers below from where it is radiated. The heat is extracted through thermal vias, which are thermally and/or electrically connected to the metal layers.
The Solderlink operation for applications using lead-free sweat solder takes nearly 25% of the bonding manufacturing space. High temperature solder pastes are routinely used to bond circuit boards with a heat sink. With this unique technology your bonded PCBs will not delaminate during subsequent SMT reflow.
ASC has developed proprietary bonding technology to bond heat sink with RF circuit to produce fully bonded layers with no resin bleed. Using newly developed press profile and book construction, parts are made in large volume with excellent quality. In the RF division, there are four programmed 6-opening electric heat hydraulic presses with two 6-opening cool down stations. We have also added an automatic loader and unloader to assist with handling the product. A fifth vacuum-assist hydraulic press will soon be online for bonding applications requiring vacuum.
ASC has pioneered a unique way to integrate heat sink technology into plated carrier designs. This approach increases the efficiency of heat sinks and ultimately reduces the junction temperature of electronic components. It has the capability to bond PCBs with several mediums including various types of “thermally and electrically conductive” or “thermally conductive and electrically insulating” adhesives and lead-free sweat soldering. We specialize in bonding PCBs to Aluminum, Brass, Copper, etc. for various applications. The thermal and electrical conductivity and adhesive thickness and mechanical characteristics can be tailored to customer specific requirements.
We have the capacity in our bonding facility for prototype to high volume production. Our R&D staff closely work with your engineering team to build the part quickly and at the lowest cost as the customer-specific adhesive materials are synthesized in-house.
For further information on products please email: firstname.lastname@example.org. For questions relating to design guidelines, R&D and new materials technologies, please contact our R&D / Engineering Department at 630-639-5444