Call us at (630) 639-5444

Capabilities

Explore our capabilities

We can manufacture printed circuit boards on virtually any substrate. any size, and any shape. Technology types include, but are not limited to RF/Microwave printed circuit boards, rigid printed circuit boards, metal clad boards, flex, and rigid-flex circuits.

  • Layers (1-34) 
  • Lines and Spaces 3mil line / 3mil space 
  • Panel Thickness <= 350 mils
  • Controlled Impedance +/- 5% 
  • All types of final finish available 
  • Blind and Buried Vias 
  • Heat Sink Technology 
  • High Performance and Emerging Technology Materials 
  • Sequential Lamination
  • Conductive and Non-Conductive Via Fill 
  • BGA 
  • Ultra Fine Pitch 
  • Single-sided Flex 
  • Double-sided Flex 
  • Dual Access
  • Stiffeners of Polyimide or FR-4
  • Multilayer Flex 
  • Rigid Flex 
    • Multilayer up to 16 Layers 
  • Pre-CAM DRC Analysis
  • CAM-controlled Panelization with DFM
  • Extracted Net-list Comparison
  • Lead free alternative High Tg laminates:
    - Example, Isola 370HR, 185HR, Iteq 180A, Ventec VT47, Grace GA170
  • All Teflon (Rogers, Taconic,  Nelco)
  • Standard FR4, FR406, FR408, BT, Cyanate Esters
  • Polyimides
  • GETEK/Megtron/Nelco-13
  • Ceramic of various types
  • IMS Materials: Aismalibar, Bergquist, C-Sem, Ventec
  • Innerlayer maximum Cu weight: 6oz
  • Outerlayer maximum Cu weight: 8oz
  • Minimum Cu weight: 1/4 oz
  • Minimum core thickness: .002"
  • Maximum layer count: 34
  • Minimum multilayer thickness: .025"
  • Maximum multilayer thickness (non-HASL): .350"
  • Maximum multilayer thickness (HASL or LF HASL): .170"
  • Blind/buried vias – sequential lamination
  • Design and Verification of impedance control
  • Minimum conductor width: 
    Start Cu Foil weight Internal External
    0.5 oz. .003" .004"
    1.0 oz. .004" .005"
    2.0 oz. .005" .006"
    3.0+ oz. .006" .007"
  • Minimum feature spacing: 
    Start Cu Foil weight  Internal External
    0.5 oz. .003" .004"
    1.0 oz. .005" .006"
    2.0 oz. .006" .0075"
    3.0+ oz. .007" .009"
  • Max. Aspect Ratio: 14 to 1
  • Min. hole size tolerance (plated):+ .003" Min hole size tolerance (unplated): +.0015"
  • Min. drilled hole size: 6 mil; maximum hole size: 250 mil
  • Min. annular plane clearance of drilled hole: .010"
  • Min. internal pad size to drill hole size: +.012"
  • Min. external pad size to drill hole size: +.010"
  • Spray-coated Photo-imageable solder mask
  • Screened epoxy solder mask
  • Screened UV-curable via plugging
  • Peelable mask with stencil
  • Min. web thickness: .004
  • Min. solder mask clearance : .0025
  • Conductive
  • Non-Conductive
  • HASL - Hot Air Solder Level
  • Lead Free Hot Air Level
  • ENIG - Electroless Nickel / Immersion Gold
  • Electroless Palladium
  • Electrolytic Hard Gold over Electrolytic Nickel
  • Electrolytic Soft gold and Electrolytic Nickel
  • Immersion Tin
  • Immersion Silver
  • OSP - Organic Solderable Preservative
  • Carbon ink - switch pads
  • Scoring - CNC (jump scoring available); Web Routing: available
  • Edge milling
  • Hard-tool Pierce and /or Blank
  • Edge beveling
  • Minimum slot width:.020"
  • Min. inside radius (milled): .015"
  • Min. Distance of Plated Hole to internal Trace or Plane .0075"
  • Min. Distance of Non-Plated Hole to internal Trace or Plane: Internal: .0075", External .006" 
  • Standard finished Minimum Annular Ring is .001", if not specified.
  • Min. Pad to Drill Hole Size: Internal .010", External .008"
  • Min. Plane Clearance to Drill Hole: .020"
  • Min. Drilled Hole Size: .008"
  • Dual Access Testing - Universal grid
  • Net list Testing (Gerber - extracted/IPC- D-356)
  • Fixtureless Testing for Proto/Small Volume
  • Impedance Testing (Polar CITS-500) Impedance Tolerance: + /- 5%
  • Min. Continuity Test: 10 Ohm
  • Max Isolation Test:10 M Ohm
  • Voltage: 20 - 1000 VDC
  • Fine Pitch Testing:
    • Min. SMD Pitch (fixtureless): .012"
    • Min. BGA Pitch (fixture): 1 mm (.0394)
  • RF Telecommunication (500 MHz to 100 GHz); Complex board shapes fabricated using CNC routing, milling; Machining tolerances: ±.005", down to ±.001"; Aluminum-backed PTFE circuit with nickel and gold plating on both copper circuitry and aluminum
  • Single and double-sided circuits with thermally conducting electrically insulating bonding film (Thermasil) between circuitry and heat sink base; Copper circuitry with various Cu thicknesses and final finish can be bonded with Al of various types and thickness; For heat management applications: Power supplies, Automotive electronics including LEDs, Computers, Motor controls, and Power semiconductors